Analysis of Stress and Deformation in the Grain Boundary of the Anisotropic Copper Bicrystals

DUAN Xian-yun; RUAN Feng; ZHANG Sai-jun

Journal of Beijing University of Technology > 2013 > 39(11): 1740-1745.

DUAN Xian-yun, RUAN Feng, ZHANG Sai-jun. Analysis of Stress and Deformation in the Grain Boundary of the Anisotropic Copper Bicrystals[J]. Journal of Beijing University of Technology, 2013, 39(11): 1740-1745.

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Analysis of Stress and Deformation in the Grain Boundary of the Anisotropic Copper Bicrystals

School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China

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Received Date: October 22, 2012
Available Online: November 02, 2022

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Abstract

Based on the crystallographic constitutive theory and finite element program, the compressed stress field in the grain boundary (GB) plane of the anisotropic copper bicrystals was calculated. The stress alternation near the GB and the grain slipping defomation were analysed. Result shows that there are stress gradient and concentration in the GB, the crystallographic orientation have big effect on stress distribution, and the slipping deformation occurs at some part of the grain firstly. According to the beam deformation theory, the periodical distorted deformation and facial stress of the vertical GB were analysed and induced.
- grain boundary,
- grain boundary plane,
- crystal plasticity,
- copper bicrystal

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