QIN Fei, CHEN Na, HU Shi-sheng. Dynamic Mechanical Properties of Lead-free Solders[J]. Journal of Beijing University of Technology, 2009, 35(8): 1009-1013.
    Citation: QIN Fei, CHEN Na, HU Shi-sheng. Dynamic Mechanical Properties of Lead-free Solders[J]. Journal of Beijing University of Technology, 2009, 35(8): 1009-1013.

    Dynamic Mechanical Properties of Lead-free Solders

    • The dynamic mechanical properties of 63Sn37Pb、96.5Sn3.5Ag and 96.5Sn3.0Ag0.5Cu have been investigated at high strain rate by using the split Hopkinson pressure/tensile bar technique.Stress-strain curves of the three materials were obtained at strain rates, ranging from 600 s-1 to 2 200 s-1.The experimental results show that all the three materials are strongly strain rate dependent, of which 96.5Sn3.5Ag is relative more sensitive to strain rate, while at the same strain rate 96.5Sn3.0Ag0.5Cu has the greatest yield and ultimate tensile stresses.
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