Theoretical and Experimental Research on a Novel Silicon Directly Bonding Technology

In order to realize silicon/silicon directly bonding under the ultra-clean environment, a novel method and a physical model for silicon/silicon directly bonding with the help of alcohol were proposed in this paper. Under a one hundred thousands class clean environment and atmosphere pressure, the homemade silicon wafers directly bonding experiment was performed successfully at room temperature. The tensile test showed that the bonding tensile strength is as much as 10MPa. No inter-space in the interface was found by SEM observation. These results imply that the bonding quality is good and can meet the requirement. The method is proved to be practically feasibel.