QIN Fei, AN Tong, WANG Xuming. Rate-dependent Constitutive Model for Lead-free Solders Considering Damage Effect[J]. Journal of Beijing University of Technology, 2013, 39(1): 14-18.
    Citation: QIN Fei, AN Tong, WANG Xuming. Rate-dependent Constitutive Model for Lead-free Solders Considering Damage Effect[J]. Journal of Beijing University of Technology, 2013, 39(1): 14-18.

    Rate-dependent Constitutive Model for Lead-free Solders Considering Damage Effect

    • In this paper,the damage effect was considered into the impact process of lead-free solder specimens.Based on the experimental data,the modified rate-dependent Johnson-Cook model for the Sn3.0Ag0.5Cu and Sn3.5Ag lead-free solders were derived.The stress-strain curves obtained from the modified Johnson-Cook material models and the experiments agreed quite well with each other.It indicates that presented modified Johnson-Cook models are suitable to describe the dynamic behavior of the two lead-free solder materials.
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