Enhanced Heat Transfer from Air-Cooled Rectangular Electronic Component by Means of Promoters

Two types of enhanced promoters were employed for improving the air cooling of the electronic components in-line arrangements. The average heat transfer coefficient of the forced convection increased by 25%. The experimfnts were conducted with Re ranging from 2800 to 22000. A set of empirical formulas was presented to correlate the experimental data for each specific configuration. On the basis of the flow visualization the mechanism of heal transfer procession was explained.