Enhanced Heat Transfer from Simulated Microchips to Surrounding Liquid of Low Volatility with Gas Jet Impingement

Heat transfer from simulated microchips to surrounding liquid of low volatility with gas jet impingement was studied experimentally. Compaired with the free convection data, the heat transfer coefficient at stagnation zone could be 13 times as high as that at high jet velocity. The effects of jet velocity, heat flux and nozzle-to-plate spacing were inves tigated. The measured heat transfer coefficient distribution showed that the maximum did not appear at stagnation piont but above it. An empirical formular was presented, that may be used for both high and low volatility liquids.