Silver Plating Chemically on Non-metallic Materials

HUANG Shao-qiang; QIU Wen-ge; LI Sheng-hua

doi:10.3969/j.issn.0254-0037.2005.01.017

Journal of Beijing University of Technology > 2005 > 31(1): 75-80. > DOI: 10.3969/j.issn.0254-0037.2005.01.017

HUANG Shao-qiang, QIU Wen-ge, LI Sheng-hua. Silver Plating Chemically on Non-metallic Materials[J]. Journal of Beijing University of Technology, 2005, 31(1): 75-80. DOI: 10.3969/j.issn.0254-0037.2005.01.017

Citation:

PDF (232 KB)

Silver Plating Chemically on Non-metallic Materials

College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 100022, China

More Information

Received Date: October 14, 2003
Available Online: November 21, 2022

Graphical Abstract

Abstract

Abstract

Silver plating chemically on nonmetallic materials was introduced. The technique of siver plating chemically on non-metallic materials generally consist of two steps:surface pretreatment and silver plating chemically. The former process includes roughing, sensitizing and activating. According to different mechanism, there techniques of silver plating chemically, namely, reduction, replace and self-assemble, were reviewed.
- non-metallic materials,
- surface pretreatment,
- silver plating chemically

FullText(HTML)

References (44)

References

[1]	孙酣经.功能高分子材料及应用[M].北京:化学工业出版社,1990.56. SUN Han-jing. Functional Polymer Composites and Their Applications[M]. Beijing:Chemical Industry Press, 1990. 56. (in Chinese)
[2]	谭松庭,章明秋,曾汉民.屏蔽EMI用导电性高分子复合材料[J].材料工程,1998(5):6-9. TAN Song-ting, ZHANG Ming-qiu, ZENG Han-min. Electroconductive polymer composites for shielding EMI[J]. Materials Engineering, 1998(5):6-9. (in Chinese)
[3]	杜仕国.抗电磁干扰高分子材料的研究与应用[J].军械工程学院学报,1995,7(3):21-25. DU Shi-guo. Study and application of anti-electromagnetic interference polymer composites[J]. Journal of Ordnance Engineering College, 1995,7(3):21-25. (in Chinese)
[4]	王宏军.国外粉末导电填料/聚合物导电复合材料近期研究开发的特点[J].化工进展,1990(6):36-40. WANG Hong-jun. The characteristics of research and development of powder conductive fillers/polymer conductive composites abroad at present[J]. Progress of Chemical Engineering, 1990 (6):36-40. (in Chinese)
[5]	赵择卿.高分子材料抗静电技术[M].北京:纺织工业出版社,1991.267-271. ZHAO Ze-qing. Anti-static Electricity Technic of Polymer Materials[M]. Beijing:Textile Industry Press, 1991. 267-271. (in Chinese)
[6]	涂铭旌,黄婉霞,陈家钊,等.电磁波屏蔽功能复合材料研究进展[J].功能材料,1998(29):3-6. TU Ming-jing, HUANG Wan-xia, CHEN Jia-zhao, et al. Study condition of functional composites for shielding electromagnetic interference[J]. Functional Materials, 1998(29):3-6. (in Chinese)
[7]	华宝家,肖高志,构建生.碳纤维在结构隐身材料中的应用研究[J].宇航材料工艺,1994(3):31-34. HUA Bao-jia, XIAO Gao-zhi, GOU Jian-sheng. Study on the application of carbon fibres in the field of structural materials for concealing body[J]. Aerospace Materials & Technology, 1994(3):31-34.
[8]	徐维正.世界碳纤维前途光明[J].化工新型材料,1997(5):27-28. XU Wei-zheng. The future of carbon fibres is bright in the world[J]. New Chemical Materials, 1997(5):27-28. (in Chinese)
[9]	谢广文,姜杰,石玉龙.高分子材料表面化学镀银工艺的研究[J].青岛化工学院学报,2001,22(2):155-157. XIE Guang-wen, JIANG Jie, SHI Yu-long. Study on the process of electroless silver plating on the surface of polymer com-posites[J]. Qingdao Institute of Chemical Technology, 2001,22(2):155-157. (in Chinese)
[10]	KIESCHE E. Antistats & conductive additives:Plenty of news for growing markets[J]. Plastics Technology, 1986, 32(7):91-92.
[11]	杜仕国.导电涂料的研究及进展[J].涂料工业,1995(6):29-31. DU Shi-guo. Study on the conductive coatings and their progress[J]. Paint & Coatings Industry, 1995(6):29-31. (in Chinese)
[12]	陈锦宏,李玮.电磁屏蔽导电涂料[J].广州化学,2001,23(1):44-47. CHEN Jin-hong, LI Wei. Conductive coatings for shielding electromagnetic interference[J]. Guangzhou Chemistry, 2001, 23(1):44-47. (in Chinese)
[13]	张兴义.导电涂料国内外的研究概况[J].电机电器技术,2000(3):33-36. ZHANG Xing-yi. Research condition of conductive coatings around the world[J]. DIANJI DIANQI JISHU, 2000(3):33-36. (in Chinese)
[14]	边蕴静.电磁波屏蔽涂料[J].化工新型材料,1997(7):17-19. BIAN Yun-jing. Coatings for shielding electromagnetic interference[J]. New Chemical Materials, 1997(7):17-19. (in Chinese)
[15]	曾华梁,吴仲达,秦月文,等.电镀工艺手册[M].北京:机械工业出版社,1989.523. ZENG Hua-liang, WU Zhong-da, QIN Yue-wen, et al. Handbook of Electroplating Technics[M]. Beijing:China Machine Press, 1989. 523. (in Chinese)
[16]	杨松青.织物上化学镀镍工艺的研究[J].有色金属(冶炼部分),1996(5):45-48. YANG Song-qing. Study on electroless nickel plating of fabrics[J]. Nonferrous Metals(Extractive Metallurgy), 1996(5):45-48. (in Chinese)
[17]	何为,唐先忠,迟兰州.碳纤维表面化学镀镍工艺研究[J].电镀与涂饰,2003,22(1):8-11. HE Wei, TANG Xian-zhong, CHI Lan-zhou. Study on technic of electroless nickel plating on surface of carbon fibres[J]. Electroplating & Finishing, 2003,22(1):8-11. (in Chinese)
[18]	HIDEO Honma, YASUNORI Kouchi. Direct electroless copper plating on alumina ceramics[J]. Plat Surf Finish, 1990,77 (6):54-58.
[19]	MANDICH N V, KRULIK G A. On the mechanisms of plating on plastics[J]. Plat Surf Finish, 1993,80(12):68-73.
[20]	姜晓霞,沈伟.化学镀理论及实践[M].北京:国防工业出版社,2000.358-363. JIANG Xiao-xia, SHEN Wei. The Fundamental and Practice of Electroless Plating[M]. Beijing:National Defence Industry Press,2000. 358-363. (in Chinese)
[21]	熊晓东,翟玉春,田彦文.联氨化学镀液的研究概况[J].电镀与精饰,1996,18(5):21-25. XIONG Xiaodong, ZHAI Yu-chun, TIAN Yan-wen. The general situation of the study on chemical plating solution of hy-drazine[J]. Plating & Finishing, 1996,18(5):21-25. (in Chinese)
[22]	《表面处理工艺手册》编审委员会.表面处理工艺手册[M].上海:上海科学技术出版社,1994.251-252. The Editor Committee of Surface Treatment Technical Manual. Surface Treatment Technical Manual[M]. Shanghai:Shanghai Scientific & Technical Publishers, 1994. 251-252. (in Chinese)
[23]	绳舟秀美,城口廃子,谷久保正人,等.2-还原剂无电解银[J].表面技术,1999, 50(10):928-932. HIDEMI N, KEIKO S, MASATO T, et al. Autocatalytic eletroless silver deposition using 2-aminoethanethiol as reducing agent[J]. Hyomen Gijutsu Kyokai, 1999,50(10):928-932. (in Japanese)
[24]	绳舟秀美.金属他[J].表面技术,1990,41(12):1283-1284. INOUE T. Electroless noble metals plating on non-metallic powders[J]. Hyomen Gijutsu Kyokai, 1990, 41(12):1283-1284. (in Japanese)
[25]	陈小华,张高明,李宏健,等.碳纳米管的化学镀银及SEM研究[J].湖南大学学报(自然科学版),1999,26(6):14-17. CHEN Xiao-hua, ZHANG Gao-ming, LI Hong-jian, et al. Preparation of coating of carbon nanotube with silver and SEM study[J]. Journal of Hunan University(Natural Science Edition), 1999,26(6):14-17. (in Chinese)
[26]	EBBESEN T W, HIURA H, MARGARE E. Carbon nanotubes decoration[J]. Adv Mater, 1996(8):155.
[27]	王玲.用化学镀实现陶瓷微粒表面金属化[J].材料保护,1998,31(7):16-17. WANG Ling. Metalize the ceramic powders by electroless plating[J]. Materials Protection, 1998, 31(7):16-17. (in Chinese)
[28]	何志亮,邢建东,高义民.陶瓷颗粒化学镀镍工艺及设备[J].电镀与精饰,2003,25(3):27-29. HE Zhi-liang, XING Jian-dong, GAO Yi-min. Process and equipment of electroless nickel plating on porcelain granule[J]. Plating and Finishing,2003,25(3):27-29. (in Chinese)
[29]	KOBAYASHI Yoshio, SALGUEIRINO-MACEIRA Veronica, LIZ-MARZAN L M. Deposition of silver nanoparticles on silica spheres by pretreatment steps in electroless plating[J]. Chem Mater, 2001,13(5):1630-1633.
[30]	陈怀超,韩志忠.钛合金上直接镀银工艺[J].材料保护,2002,35(1):28. CHEN Huai-chao, HAN Zhi-zhong. Direct silver plating technic on Ti alloy[J]. Materials Protection, 2002,35(1):28. (in Chinese)
[31]	李贤成.玻璃化学镀银[J].材料保护,1995,28(9):30. LI Xian-cheng. Electroless silver plating on glass[J]. Materials Protection, 1995,28(9):30. (in Chinese)
[32]	蔡积庆.镜制品化学镀银[J].电镀与环保,2002,22(4):23-24. CAI Ji-qing. Chemical silver plating on glass[J]. Electroplating & Pollution Control, 2002,22(4):23-24. (in Chinese)
[33]	郑仕远.水钻表面镀银新工艺[J].电镀与涂饰,2000,19(3):15-16. ZHENG Shi-yuan. New technic of silver plating on diamond[J]. Electroplating & Finishing,2000,19(3):15-16. (in Chi-nese)
[34]	李杰森,唐清.石英杜瓦管化学镀银工艺[J].电镀与精饰,1995,17(3):17-18. LI Jie-sen, TANG Qing. Electroless silver plating on quartz tubes[J]. Plating and Finishing, 1995,17(3):17-18. (in Chinese)
[35]	黄少强,邱文革.玻璃微球表面化学镀银[J].电镀与涂饰,2004,23(1):7-9. HUANG Shao-qiang, QIU Wen-ge. Electroless silver plating on glass microspheres[J]. Electroplating & Finishing, 2004, 23(1):7-9. (in Chinese)
[36]	CHENG H M, ZHOU B L, ZHENG Z G. Chemical silver plating on carbon fibers[J]. Plat Surf Finish, 1990,77(5):130-132.
[37]	WARRIER S G, LIN R Y. Silver coating on carbon and SiC fibres[J]. J Mater Sci, 1993,28(18):4868-4877.
[38]	川上浩,小山田雅明.无电解银粉体制造方法[P].JP:11061424,1999-03-05. INOUE T, KUMAGAI T. The Fabrication Technics of Electroless Silver Plating on Powders[P]. JP:11061424, 1999-03-05. (in Japanese)
[39]	高保娇,蒋红梅,张忠兴.用银氨溶液对微米级铜粉镀银反应机理的研究[J].无机化学学报,2000,16(4):669-673. GAO Bao-jiao, JIANG Hong-mei, ZHANG Zhong-xing. Study on the mechanism of silver plating on micron scale Cu powder by using argentamine[J]. Chinese Journal of Inorganic Chemistry, 2000,16(4):669-673. (in Chinese)
[40]	ELMORE G V. Silver replacement baths[J]. Res Disci, 1993, 348:265.
[41]	HONMA H, HASEGAWA A. Displacement Type Silver Electroless Plating Bath[P]. JP:309875A, 2000-11-07.
[42]	刘正春,贺全国,肖鹏峰,等.自组装化学镀银[J].化学学报,2002,60(4):627-632. LIU Zheng-chun, HE Quan-guo, XIAO Peng-feng, et al. Electroless Ag plating on self-assembly monolayer[J]. Acta Chimica Sinica,2002,60(4):627-632. (in Chinese)
[43]	浜谷健生,熊谷八百三.理无电解[J].表面技术,1990,41(11):1159-1162. HAMAYA T, KUMAGAI Y. Electroless nickel deposition to the glass beads treated with aminosilane[J]. Hyomen Gijutsu Kyokai, 1990,41(11):1159-1162. (in Japanese)
[44]	BRENNER A, RIDDELL G E. Nickel plating on steel by chemical reduction[J]. J Research Natl Bur Standards, 1946, (37):31-34.

Cited By

Get Citation

PDF

XML

Article views (113) PDF downloads (23)

Turn off MathJax

Article Contents

Abstract

References

Silver Plating Chemically on Non-metallic Materials

Abstract

References

Catalog

Export File

Citation

Format

Content