Numerical Study of the Effects of System Temperature on Heat Transfer at the Solid-Liquid Interface

WANG Jun; LI Haiyang; XIA Guodong

doi:10.11936/bjutxb2022120006

Journal of Beijing University of Technology > 2024 > 50(7): 864-871. > DOI: 10.11936/bjutxb2022120006

WANG Jun, LI Haiyang, XIA Guodong. Numerical Study of the Effects of System Temperature on Heat Transfer at the Solid-Liquid Interface[J]. Journal of Beijing University of Technology, 2024, 50(7): 864-871. DOI: 10.11936/bjutxb2022120006

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Numerical Study of the Effects of System Temperature on Heat Transfer at the Solid-Liquid Interface

MOE Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Beijing Key Laboratory of Heat Transfer and Energy Conversion, Beijing University of Technology, Beijing 100124, China

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Received Date: December 05, 2022
Revised Date: December 26, 2022
Available Online: May 27, 2024

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Abstract

Abstract

In the present paper, the effect of system temperature and solid-liquid bond strength on the thermal transport has been investigated based on the non-equilibrium molecular dynamics simulations. It is revealed that the interfacial thermal resistance decreases with increasing temperature, and the interfacial thermal resistance of the hydrophilic interface has a weak temperature dependence. The interfacial thermal transport mechanism is analyzed based on the microscale calculation formula of the heat flux. With increasing temperature, both the contributions by the kinetic and virial term can be enhanced. The proportion of the kinetic term increases, while the proportion of the virial term decreases with increasing temperature. For strong interfacial couplings, the virial term can be enhanced, which is the dominate mechanism for the enhanced interfacial heat transfer.
- interfacial thermal resistance,
- molecular dynamics simulation,
- solid-liquid interface,
- temperature dependence,
- wettability,
- microscale heat flux

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References (42)

References

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