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    秦飞, 安彤, 王旭明. 考虑损伤效应的无铅焊锡材料的率相关本构模型[J]. 北京工业大学学报, 2013, 39(1): 14-18.
    引用本文: 秦飞, 安彤, 王旭明. 考虑损伤效应的无铅焊锡材料的率相关本构模型[J]. 北京工业大学学报, 2013, 39(1): 14-18.
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    QIN Fei, AN Tong, WANG Xuming. Rate-dependent Constitutive Model for Lead-free Solders Considering Damage Effect[J]. Journal of Beijing University of Technology, 2013, 39(1): 14-18.
    Citation: QIN Fei, AN Tong, WANG Xuming. Rate-dependent Constitutive Model for Lead-free Solders Considering Damage Effect[J]. Journal of Beijing University of Technology, 2013, 39(1): 14-18.
    shu

    考虑损伤效应的无铅焊锡材料的率相关本构模型

    Rate-dependent Constitutive Model for Lead-free Solders Considering Damage Effect

      摘要
    • 摘要: 考虑冲击过程中无铅焊锡材料试件中的损伤影响,根据实验数据确定了损伤演化参数,对原模型进行了修正,给出了Sn3.0Ag0.5Cu和Sn3.5Ag两种无铅焊锡材料考虑损伤效应的率相关本构模型.结果表明,修正后的模型与实验结果吻合较好.

       

      Abstract: In this paper,the damage effect was considered into the impact process of lead-free solder specimens.Based on the experimental data,the modified rate-dependent Johnson-Cook model for the Sn3.0Ag0.5Cu and Sn3.5Ag lead-free solders were derived.The stress-strain curves obtained from the modified Johnson-Cook material models and the experiments agreed quite well with each other.It indicates that presented modified Johnson-Cook models are suitable to describe the dynamic behavior of the two lead-free solder materials.

       

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