Abstract: A method of dismantling electronic components in waste PCBs resource treatment process is proposed.Air is used as the desoldering heating medium,and the process of desoldering is simulated by fluid software-Fluent.The factors of hot blast temperature and speed and the structure of nozzle are analyzed.Results show that the optimum hot blast temperature is 473-503 K and speed is about 7 m/s.Meanwhile,the structure of nozzle not only influences the heating efficiency,but also the temperature field distribution.Reasonable sizes of the nozzle are 9 mm in diameter,20°-30° in angle of α,and 4 mm in height,when the distance from the nozzle to PCB is 30 mm.