范晋伟, 印健, 潘日. 微流控芯片磁性抛光工艺参数优化[J]. 北京工业大学学报, 2021, 47(3): 209-215, 302. DOI: 10.11936/bjutxb2019120029
    引用本文: 范晋伟, 印健, 潘日. 微流控芯片磁性抛光工艺参数优化[J]. 北京工业大学学报, 2021, 47(3): 209-215, 302. DOI: 10.11936/bjutxb2019120029
    FAN Jinwei, YIN Jian, PAN Ri. Optimization of Magnetic Polishing Process Parameters of Microfluidic Chip[J]. Journal of Beijing University of Technology, 2021, 47(3): 209-215, 302. DOI: 10.11936/bjutxb2019120029
    Citation: FAN Jinwei, YIN Jian, PAN Ri. Optimization of Magnetic Polishing Process Parameters of Microfluidic Chip[J]. Journal of Beijing University of Technology, 2021, 47(3): 209-215, 302. DOI: 10.11936/bjutxb2019120029

    微流控芯片磁性抛光工艺参数优化

    Optimization of Magnetic Polishing Process Parameters of Microfluidic Chip

    • 摘要: 以提高微流控芯片表面质量为目的,进行磁性抛光微流控芯片的关键工艺参数优化研究.首先,设计单因素实验组,根据实验结果,得到磁性抛光关键工艺参数对其抛光质量的影响规律:随着抛光间隙的减小,芯片表面粗糙度由0.327 μm增至0.045 μm,后又降至0.130 μm,其最佳抛光间隙为1.5 mm;主轴转速对抛光质量的影响并不显著,改变转速进行抛光后芯片表面粗糙度保持在0.045~0.055 μm,其最佳范围为400~800 r/min;微流控芯片表面粗糙度随着抛光时间增加而提高,最高表面粗糙度为0.018 μm,相对而言,最佳抛光时间为30 min.此外,磁性复合流体(magnetic compound fluid,MCF)抛光质量受加工间隙影响最大,受抛光时间的影响略大于主轴转速.实验结果表明,通过对磁性抛光的关键工艺参数进行优化,可以将微流控芯片的表面粗糙度从0.510 μm提高到0.018 μm,由此可进一步探索磁性抛光技术应用于微流控芯片的确定性抛光.

       

      Abstract: This paper aims to improve the surface quality of microfluidic chips, and to develope optimization research on key process parameters of magnetic polishing microfluidic chips. First, a single-factor experimental group was designed. According to the experimental results, the influence law of the key process parameters of magnetic polishing on its polishing quality is that as the polishing gap decreases, the surface roughness of the chip improves from 0.327 μm to 0.045 μm, and then is reduced to 0.130 μm, and the optimal polishing gap is 1.5 mm. The spindle speed affected the torque of the magnetic polishing and the centrifugal force of the polishing medium, however, its effect on the polishing quality was not significant. The surface roughness of the chip remained at 0.045-0.055 μm after polishing by changing the speed and the optimal speed was 400-800 r/min. The surface roughness of the microfluidic chip improved with increasing polishing time, and the highest surface roughness was 0.018 μm. In contrast, the optimal polishing time was 30 minutes. Additionally, the polishing quality of MCF was most affected by the machining gap, and the polishing time was slightly greater than the spindle speed. The experimental results show that by optimizing the key process parameters of magnetic polishing, the surface roughness of the microfluidic chip can increase from 0.510 μm to 0.018 μm, which can further explore the application of magnetic polishing technology to microfluidic chips definite polishing.

       

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