各向异性铜双晶晶界应力与晶界形变分析

    Analysis of Stress and Deformation in the Grain Boundary of the Anisotropic Copper Bicrystals

    • 摘要: 基于晶体滑移理论和率相关的晶体滑移有限元程序, 对压缩面力作用下的各向异性铜双晶晶界平面处应力场进行了计算, 对晶界附近应力变化与晶粒滑移变形进行了分析;根据梁变形理论, 对垂直晶界的周期性扭曲变形和周期法向应力进行了理论分析和推导说明.结果表明:在晶界处存在较大的应力梯度和应力集中现象, 晶粒的取向对晶界面的应力分布有很大的影响, 晶粒的滑移变形是从部分区域先行开动.

       

      Abstract: Based on the crystallographic constitutive theory and finite element program, the compressed stress field in the grain boundary (GB) plane of the anisotropic copper bicrystals was calculated. The stress alternation near the GB and the grain slipping defomation were analysed. Result shows that there are stress gradient and concentration in the GB, the crystallographic orientation have big effect on stress distribution, and the slipping deformation occurs at some part of the grain firstly. According to the beam deformation theory, the periodical distorted deformation and facial stress of the vertical GB were analysed and induced.

       

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