Ni/AlGaN/GaN结构中肖特基势垒温度特性

    Temperature Characteristics of AlGaN/GaN HEMT's Ni/Au Schottky Contact

    • 摘要: 通过I-V测量研究了AlGaN/GaN异质结构上的肖特基接触与温度的关系.在室温下肖特基势垒高度为0.75 eV,理想因子为2.06.温度升高,肖特基势垒高度增加,理想因子下降,主要原因是受异质结和二维电子气的影响.在正向电流为1 mA时,室温下的正向电压为1.65 V,从室温到300℃范围内正向电压的温度系数为-1.6 mV/℃.

       

      Abstract: The temperature characteristics of A1GaN/GaN heterosturture's Schottky contact is described by I-V measurement. At room temperature, Schottky barrier height is 0.75 eV, the ideality factor is 2.06. When the temperature rises, Schottky barrier height rises too, but the ideality factor decreases. The main reason is the effect of heterostructure and two dimension electronics gas(2DEG). When the forward current is 1 mA, the forward voltage at room temperature is 1.65 V. The temperature coefficent of the forward voltage between room temperature and 300 ℃ is - 1.6 mV/℃.

       

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