SiCp/Cu复合材料的热膨胀性和导热性

基金项目:

国家和北京市自然科学基金

详细信息

The Thermal Expansion and ThermalConductivity of SiCp/Cu Composites

Department of Materials Science and Engineering, Beijing Polytechnic University, Beijing, 100022

摘要: 采用热等静压的方法制备了SiCp/Cu电子封装复合材料.材料热膨胀系数(CTE)和导热率的测定表明,增加SiC体积分数和减小SiC颗粒的尺寸有利于降低CTE值;SIC质量分数超过26%这一临界值后,材料导热率会明显下降.减小残余应力有利于降低材料的CTE值.
- 电封装 /
- SiCp/CU复合材料 /
- 热膨胀系数 /
- 导热率
Abstract: SiC particle reinforced Cu matrix composites were fabricated via hot isostatic processing for electronic packaging. The results indicate that the coefficient of the thermal expansion (CTE) of composites depends on the SiC particle size and its volume fraction. The minimal CTE value has been obtained from an annealing for releasing residual stress. The thermal conductivity is found to be higher when the volume fraction of Cu exceeds a threshold because of the matrix formed a continuous phase.
- electronic packaging /
- SiCp/Cu composites /
- thermal expansion coefficient /
- thermal conductivity