用强化器增强空冷块状电子元件的传热

Enhanced Heat Transfer from Air-Cooled Rectangular Electronic Component by Means of Promoters

摘要: 使用两种强化器改善了顺排电子元件的空气冷却,使强迫对流平均传热系数提高25%,整个实验是在R_e=2800~22000范围内进行的,根据每种强化器的特殊结构和实验数据,关联出与之相应的经验公式,基于流动显示,对整个传热过程的机理也作了解释。
- 强化器 /
- 空冷 /
- 电子元件
Abstract: Two types of enhanced promoters were employed for improving the air cooling of the electronic components in-line arrangements. The average heat transfer coefficient of the forced convection increased by 25%. The experimfnts were conducted with Re ranging from 2800 to 22000. A set of empirical formulas was presented to correlate the experimental data for each specific configuration. On the basis of the flow visualization the mechanism of heal transfer procession was explained.
- Promoters /
- air-cooled /
- electronic components