Abstract: Package on package (PoP) is a widely used 3D packaging technology.In this paper,a finite element approach is proposed to simulate the entire assembly process of a PoP component through the techniques of element die and birth as well as restart in ABAQUS,and the approach is applicable to transfer stress and warpage in one process to the next so that the evolution of stresses and warpages during assembly can be predicted.Simulation results show that the approach is feasible and effective.