Abstract: The electromigration damage evolution of BGA solder joints under high temperature and high current density condition was studied. Based on the COMSOL Multiphysics 5.5, a damage recording method was proposed to simulate the electro-thermal-mechanical multi-physics coupling and to analyze the generation and expansion of electromigration voids. The effects of four kinds of atoms diffusion force were comprehensively considered, including electron wind, temperature gradient, stress gradient and atomic concentration gradient. Results show that the electron wind force plays a major role in the formation of the electromigration voids, on the contrary, the atom gradient flux inhibits the excessive atom migration. The ambient temperature affects the atomic diffusion coefficient of the solder joint, and the atoms diffusion coefficient is larger at higher temperatures. When the ambient temperature is in the temperature cycle condition, the stress gradient flux and the electron wind flux become the main atoms migration force.