Abstract: To solve the problem that the silicon chip leak detection is easy to occur due to the thickness of the silicon chip below 0.1 mm. In this paper, a method for positioning detection of wafer level distribution was proposed based on OpenCV. The front edge profile of the wafer sample image was obtained by using the image preprocessing technology. The difference between the edge profile of the test image and the image in the sample library was calculated to determine whether the silicon layer existed in the silicon layer by the sum of the pixel points to reach the prescribed threshold value, and then positioning detection of the silicon wafer level distribution was achieved. The results show that the proposed method can effectively improve the reliability of positioning detection of the silicon wafer level distribution when silicon wafer with thickness is less than 0.1 mm, and the algorithm is simple, real-time and compatible.