激光加工匙孔动态行为X射线原位监测研究进展

    Progress in X-ray In-situ Monitoring of Keyhole Dynamic Behavior During Laser Processing

    • 摘要: 激光加工技术可分为热导模式与匙孔模式2类。其中,匙孔模式加工过程中产生的匙孔效应显著提高了激光能量的利用效率,然而这一过程涉及材料的固、液、气、等离子体(羽辉)多相耦合的瞬态演变,极易产生飞溅、气孔等加工缺陷,严重制约了激光制造技术的进一步应用。为解决该瓶颈问题,需要深入揭示匙孔动态演化机制。相较于传统可见光、声信号等监测手段,具有强穿透特性的X射线为实现材料内部动态过程的原位监测提供了新途径。因此,聚焦匙孔的产生、动态行为以及稳定性调控3个核心问题,对匙孔模式激光加工领域的最新研究进展进行了总结。此外,不仅对X射线的分类、原理进行了阐述,同时,对未来的机遇以及可能遇到的挑战进行了总结与展望。

       

      Abstract: Laser processing technologies can be categorized into two modes: conduction and keyhole mode. In particular, the keyhole effect generated during the keyhole-mode processing significantly enhances the efficiency of laser energy utilization. However, this process involves the transient multiphase coupling of solid, liquid, gas, and plasma (plume) phases, rendering it highly susceptible to defects such as spattering and porosity. These defects severely limit the broader application of laser manufacturing technologies. Addressing this bottleneck necessitates an mechanistic understanding of the dynamic keyhole evolution. Compared with conventional monitoring techniques, such as visible light and acoustic signals, X-ray imaging, owing to its strong penetration capability, provides a novel approach for in-situ observation of internal dynamic processes within materials. This review focuses on three key aspects: keyhole initiation, dynamic behavior, and stability control, and summarizes the latest research progress in the field of keyhole-mode laser processing. Furthermore, it outlines the classification and underlying principles of X-rays, and offers perspectives on future opportunities and potential challenges in this field.

       

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